Heat Sink Compound Types

More buying choices 32 99 8 new offers thermal paste 5 pack thermalcoolflux tm high performance polysynthetic silver thermal paste.

Heat sink compound types.

Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices. Type z9 1 fluid ounce. 4 6 out of. These compounds are commonly used with transistors diodes rectifiers and transformers.

Thermal joint compound for any device where efficient cooling is desired. For mounting transistors diodes rectifiers and resistors. Excellent heat transfer efficiency. For effective transfer of heat between components heat sinks will not dry or harden white paste.

Silicone compound blended with thermally conductive fine metal oxide powders. Temperature range from 45 degrees f to 500 degrees f. 1446622 silicone heat sink compound lubricant grease 5 oz 140 g tube. In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.

Zinc oxide compounds create a more secure bond than silicone compounds. Will not harden or melt. Thermal joint compound for any device where efficient cooling is desired. For effective transfer of heat between components heat sinks will not dry or harden white past.

In order to choose the correct heat sink for cooling electronic applications it s useful for engineers to understand the definitions uses and benefits of different types of heat sinks. Will not react to rubber or plastic. Silicone base extra high efficiency heat transfer. Bond heat sinks to surfaces eliminating air gaps for maximum heat transfer.

Since air is one of the worst thermal conductors on earth it will impede the heat sink s ability to lower the cpu temperature. Type z9 1 fluid ounce. Super lube silicone heat sink 3 oz. For mounting transistors diodes rectifiers and resistors.

Silicone base extra high efficiency heat transfer. Applying thermal compound is a must because the contact surfaces are not perfectly even and smooth even brand new cpus and heat sinks have surface imperfections and microscopic scratches that traps pockets of air.